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BGA IC Adhesive Removing Liquid

BGA IC Adhesive Removing Liquid

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BGA IC Adhesive Removing LiquidBGA IC Adhesive Removing Liquid
 

CODE: RT02443

Price: $11.20

In stock

This item will free shipping by normal airmail without tracking number.
Yes, we can ship to Worldwide

BGA IC Adhesive Removing Liquid

BGA IC Adhesive removing liquid softens, and removes resinating and sealing glue of chip BGA IC of mobile phones. It does not harm to circuit board and component, even to maintaince worker.

BGA IC Adhesive Removing Liquid Features

  • It doesn not to harm to circuit board and component, even to maintaince worker
  • BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones
  • The ingredients of it is newestly, environmental protection and safest It has good permeability
  • It can quickly soften and loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon
  • Dimension: 84 x 33mm / 3.3 x 1.3 inch

 

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BGA IC Adhesive Removing Liquid