Hot Air BGA Rework Station with PLC Control Touch Screen Soldering Melding Machine for Mobile phone Laptop Repair

SOAAbga39
In stock

Hot Air BGA Rework Station with PLC Control Touch Screen Soldering Melding Machine for Mobile phone Laptop Repair

$2,119.99
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Hot Air BGA Rework Station with PLC Control Touch Screen Soldering Melding Machine for Mobile phone Laptop Repair


Features:

  • PCB dimension: W50×D50~W450×D400mm 
  • PCB thickness: 0.5~4mm
  • Working table adjustment: ±50mm forward/backward, ±200mm left/right
  • Temperature control: K-type thermocouple, close cycle controlled 
  • PCB locating way: jig
  • Pre heater: far infrared 2700W 
  • Upper heater: hot air 400W
  • Lower heater: hot air 800W 
  • Power supply:  single-phase 220V, 50/60Hz, 4.5KW
  • Machine dimension: L660×W630×H600mm 
  • Weight: Approx. 60Kgs


Specifications:

  • BGA Rework Station
  • Made of high quality heating material; desoldering and soldering procedures of BGA are
  •  precisely controlled;
  •  Air flow and temperature are adjustable in a wide range to produce high temperature breeze;
  •  Movable heating head,easy to operated;
  • Touch screen interface, PLC control; real-time temperature curve display, be able to display
  •  temperature curves and detecting curves at the same time;
  • 6 segments of temperature up (down) and 6 segments constant temperature control, 50
  • groups of temperature curves are stored, Curve analysis can be carried out on the
  •  touchscreen.
  • The temperatures of the upper and lower hot air guns can be precisely controlled according
  •   to their specific temperatures. The infrared constant temperature heating zone at the lower
  •   part and the appropriate temperature-control settings make the rework safer and more
  •   reliable.
  •  The supports for the BGA soldering supporting frame are micro-adjustable to restrain local
  •   Sink age.
  • Powerful cross flow fans cool the lower heating area rapidly;
  • The adjustable PCB positioning support, onto which the special fixtures for all type board
  •   could be installed, enables easy and fast positioning of the PCB board;
  • Buzz after soldering is finished or desoldering;Hand vacuum pen is adjustable for removing
  •  BGA;
  • Both the upper and lower parts are equipped with over-temperature alarming and protection
  •   apparatus.
  • With different alloy hot gas nozzles, easy to replace.It could be tailored as per the specific
  •   requirements.
  • The integrated design of machine and chassis is room-saving.could be altered to instrument-
  •  control.


Package Included:

  • 1 x Hot BGA rework station
  • 5 x Nozzles (44, 41, 38, 31, 26 mm,  1pc for each size) 
  • 1 x Tools box 1 pcs 
  • 1 x Inside the hexangular wrench set 
  • 1 x Clamp for motherboard set 
  • 1 x Brush
  • 1 x USB mouse
  • 1 x Vacumm IC Picker
  • 1 x Aluminium plate for BGA IC Reballing
  • 1 x Thermocouple sensor wire(High precision)
  • 1 x Reballing stencils holder
  • 33 x Reballing stencils
  • 3 x 0.5 /0.6/0.76mm leaded solder balls (1 bottle for each size , 250k/bottle) 
  • 1 x English manual

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