Hot BGA Rework Station Systems Infrared For Melding Soldering Laptop Motherboard Repair Tool in Europe and more
- Total power 1250W
- Voltage AC220V±10% 50/60Hz
- Top heater IR 400W
- Size of topr heater 80mm*80mm
- Bottom heater IR 800W
- Size of bottom heating 180mm*180mm
- PCB size Max. 400*305 mm
- BGA chip size Max. 70*70 mm
- Positioning V-groove PCB
- Temperature control K Type temperature Sensor and Closed loop
- Temperature accuracy ±2°C
- Dimension 475*480*420mm
- Net weight 16 KG
Highlights of this BGA rework station for laptop motherboard
1. USB interface.
2. 2 temperature zones
3. With tempering glass,more uniform heating
4. Hot sale model, praised by many customers.
5. Low cost.
6. Technical support is always available
7. Original Factory, look for worldwide distributors
Where this BGA rework station for laptop motherboard
1. For repairing Mobile phones
2. For repairing Notebooks/ Laptops/computers
3. For repairing game consoles, especially for XBOX360/PS3/WII
4. For repairing any other main boards with size from 22x22mm to 500x400mm
5. For preheating chips or main boards before soldering to improve rework efficiency.
- 1 x Hot BGA rework station complete Set