Hot Optical alignment Automatic Soldering BGA Rework Station for laptop mobile phones board Motherboard Repair
- Widely used in the Chip Rework in laptop,PS3,PS4,XBOX360, Moblie Phone, etc.
- Rework BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc.
- Automatic Removing,Mounting and Soldering.
- HD Optical Alignment system for precisely mounting BGA and Components.
- Laser Positioning function for Fast Positioning BGA Chip and motherboard.
- BGA Mounting Accuracy within 0.01mm , Repair success rate 99.9%.
- United Top/Bottom Hot Air Heaters, Freely Moved
- Precise Mounting Pressure Control System
- User-friendly touch screen operation system.
- Total power Max 5800W
- Top hot air heater 800W
- 2nd hot air heater 800W
- 3rd IR preheater 4000W
- Voltage AC 380V 50/60Hz
- Main structure parts Touch screen+ PLC+ High sensitive temp control module+ Optical alignment
- Temp control K-Sensor closed-loop
- PCB positioning V-groove + PCB Support, Laser Positioning
- PCB size Max 560*470mm
- BGA chip size 2×2~ 70×70mm
- External Temp Sensor 4 piece
- Dimensions L760×W850×H950mm
- Machine net weight 140kg
- 1 x Hot BGA Rework Station with Optical Alignment complete Set