Hot Optical alignment Automatic Soldering BGA Rework Station for laptop mobile phones board Motherboard repair

SOAAbga35
In stock

Hot Optical alignment Automatic Soldering BGA Rework Station for laptop mobile phones board  Motherboard repair

$2,566.58
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Hot Optical alignment Automatic Soldering BGA Rework Station for laptop mobile phones board Motherboard Repair


Main Features:

  • Widely used in the Chip Rework in laptop,PS3,PS4,XBOX360, Moblie Phone, etc.
  • Rework BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc.
  • Automatic Removing,Mounting and Soldering.
  • HD Optical Alignment system for precisely mounting BGA and Components.
  • Laser Positioning function for Fast Positioning BGA Chip and motherboard.
  • BGA Mounting Accuracy within 0.01mm , Repair success rate 99.9%.
  • United Top/Bottom Hot Air Heaters, Freely Moved
  • Precise Mounting Pressure Control System
  • User-friendly touch screen operation system.

 
Specifications:   

  • Total power Max 5800W
  • Top hot air heater 800W
  • 2nd hot air heater 800W
  • 3rd IR preheater 4000W
  • Voltage AC 380V 50/60Hz
  • Main structure parts Touch screen+ PLC+ High sensitive temp control module+ Optical alignment
  • Temp control K-Sensor closed-loop
  • PCB positioning V-groove + PCB Support, Laser Positioning
  • PCB size Max 560*470mm
  • BGA chip size 2×2~ 70×70mm
  • External Temp Sensor 4 piece
  • Dimensions L760×W850×H950mm
  • Machine net weight 140kg

Package Included:

  • 1 x Hot BGA Rework Station with Optical Alignment complete Set

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