Hot Selling Latest Mobile Phone BGA Rework Station with Optical Alignment and Automatic BGA Removal Mounting Soldering 

SOAAbga34
In stock

Hot Selling Latest Mobile Phone BGA Rework Station with Optical Alignment and Automatic BGA Removal Mounting Soldering 

$2,396.67
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Hot Selling Latest Mobile Phone BGA Rework Station with Optical Alignment and Automatic BGA Removal Mounting Soldering 


Main Features:

  • Widely used in the Chip Level Repair in laptop, PS3,PS4,XBOX360, Moblie Phone, etc.
  • Rework BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc.
  • Automatic Removing,Mounting and Soldering.
  • HD Optical Alignment system for precisely mounting BGA and Components.
  • Laser Positioning function for Fast Positioning BGA Chip and motherboard.
  • BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
  • Superior Safety Functions, with Emergency protection.
  • User-friendly operation system.


Specification:

  • Total power Max 5800W
  • Top hot air heater 1200W
  • 2nd hot air heater 1200W
  • 3rd IR pre heater 3200W
  • Voltage 220V-240V,50/60HZ
    Main structure parts Touch Screen+ PLC+ High sensitive temp control module+ Optical Alignment
  • Temp control K-Sensor closed-loop
  • PCB positioning V-groove ,with universal fixture ,can move easily
    PCB size Max 410×370mm; Min65×65mm
  • BGA chip size 1×1~ 80×80mm
  • External temp sensor 1 piece
  • Dimensions 640×630×900mm
  • Machine net weight 65kg


Package Included:

  • 1 x Hot BGA Rework Station with Optical Alignment complete Set

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