Hot Selling Latest Mobile Phone BGA Rework Station with Optical Alignment and Automatic BGA Removal Mounting Soldering
- Widely used in the Chip Level Repair in laptop, PS3,PS4,XBOX360, Moblie Phone, etc.
- Rework BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc.
- Automatic Removing,Mounting and Soldering.
- HD Optical Alignment system for precisely mounting BGA and Components.
- Laser Positioning function for Fast Positioning BGA Chip and motherboard.
- BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
- Superior Safety Functions, with Emergency protection.
- User-friendly operation system.
- Total power Max 5800W
- Top hot air heater 1200W
- 2nd hot air heater 1200W
- 3rd IR pre heater 3200W
- Voltage 220V-240V,50/60HZ
Main structure parts Touch Screen+ PLC+ High sensitive temp control module+ Optical Alignment
- Temp control K-Sensor closed-loop
- PCB positioning V-groove ,with universal fixture ,can move easily
PCB size Max 410×370mm; Min65×65mm
- BGA chip size 1×1~ 80×80mm
- External temp sensor 1 piece
- Dimensions 640×630×900mm
- Machine net weight 65kg
- 1 x Hot BGA Rework Station with Optical Alignment complete Set